TIF100 2855-10 Low Bleed Thermal Pad Thermal GAP PAD Materials For AI Processors AI Servers
Product descriptions
The TIF®100 2855-10 is a general-purpose thermal pad with balanced performance. It offers high thermal conductivity and moderate hardness. This balanced design provides good surface conformability and excellent ease of use, effectively delivering a thermal transfer path and basic physical protection for a wide range of electronic components.
Features
> Good thermal conductive: 2.8W/mK
> Good softness and fillability
> Self-adhesive without the need for additional surface adhesive
> Good insulation performance
Application
> Cooling components to the chassis of frame
> High speed mass storage drives
> Heat Sinking Housing at LED-lit BLU in LCD
> LED TV and LED-lit lamps
> RDRAM memory modules
> AD-DC Power Adapters
> Rainproof LED Power
> Waterproof LED Power
> SMD LED module
> Home appliance industry
> Power module
> Wearable device
> Solar photovoltaic panel
> LED lighting fixtures
| Typical Properties of The TIF®100 2855-10 Series |
| Property |
Value |
Test method |
| Color |
Gray |
Visual |
| Construction & Compostion |
Ceramic filled silicone elastomer |
****** |
| Density(g/cm³) |
3.0 |
ASTM D792 |
| Thickness Range(inch/mm) |
0.010~0.020 |
0.030~0.200 |
ASTM D374 |
| (0.25~0.5) |
(0.75~5.0) |
| Hardness |
65 Shore 00 |
55 Shore 00 |
ASTM 2240 |
| Recommended Operating Temperature |
-40 to 200℃ |
****** |
| Breakdown Voltage(V/mm) |
≥5500 |
ASTM D149 |
| Dielectric Constant |
6.2 MHz |
ASTM D150 |
| Volume Resistivity |
＞1.0X1012 Ohm-meter |
ASTM D257 |
| Flame rating |
V-0 |
UL 94 (E331100) |
| Thermal conductivity |
2.8 W/m-K |
ASTM D5470 |
| 2.8 W/m-K |
ISO22007 |
Product Specifications
Standard Thickness: 0.010" (0.25 mm)~0.200" (5.00 mm) with increments of 0.010" (0.25 mm)
Standard Size: 16"X16" (406 mmX406 mm)
Component Codes:
Reinforcement Fabric: FG (Fiberglass).
Coating Options: NS1 (Non-adhesive treatment),
DC1 (Single-sided hardening).
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).
The TIF® series is available in custom shapes and various forms.
For other thicknesses or more information, please contact us.
Packaging Details & Lead time
The packaging of thermal pad
1.with PET film or foam-for protection
2. use Paper Card To Separate Each Layer
3. export carton inside and outside
4. meet with customers' requirement-customized
Lead Time :Quantity(Pieces):5000
Est. Time(days): To be negotiated
Company Profile
Ziitek company is a manufacturer of thermal conductive gap fillers, low melting point thermal interface materials, thermal conductive insulators, thermally conductive tapes, electrically & thermally conductive Interface pads and thermal grease,Thermal Conductive plastic,Silicone Rubber,Silicone Foams,Phase Changing Materials products, with well-equipped testing equipment and strong technical force.
Certifications:
ISO9001:2015
ISO14001: 2004 IATF16949:2016
IECQ QC 080000:2017
UL
Ziitek Culture
Quality :
Do it right the first time, total quality control
Effectiveness:
Work precisely and thoroughly for effectiveness
Service:
Quick response, On time delivery and Excellent service
Team work:
Complete teamwork, including sales team, Marketing team, engineering team, R&D team, Manufacturing team, logistics team. All is for supporting and servicing a satisfy service for customers.
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TIF100 2855-10 Low Bleed Thermal Pad Thermal GAP PAD Materials For AI Processors AI Servers Images
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