TIF100N-40-10F Silicone Thermal Conductive Pad Cooling LED CPU GPU Heat Conductivity Interface Materials
Product descriptions
TlFTM100N-40-10F thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base.Their flexibility and elasticity make them suited to coat very uneven surfaces.Heat can transmit to the metal housing or dissipation plate from the heating elements or even the entire PCB, which effecitly enhances the efficiency and life-time of the heat-generating electronic components.
Features
> Good thermal conductive 2.0W/mK
> Moldability for complex parts
> Soft and compressible for low stress applications
> Outstanding thermal performance
> Easy release construction
> Electrically isolating
> High durability
Application
> Heat Sinking Housing at LED-lit BLU in LCD
> LED TV and LED-lit lamps
> RDRAM memory modules
> Micro heat pipe thermal solutions
> Automotive engine control units
> Telecommunication hardware
> Handheld portable electronics
> Semiconductor automated test equipment (ATE)
> CPU
> Heat pipe thermal solutions
> Memory Modules
> Mass storage devices
| Typical Properties of TIFTM100N-40-10F Series |
| Property | Value | Test method |
| Color | Gray | ***** |
| Construction &Compostion | Ceramic filled silicone elastomer | ***** |
| Specific Gravity | 2.1g/cc | ASTM D297 |
| Thickness range | 0.020inch (0.5mmT)~0.200inch (5.0mm) | ASTM D374 |
| Hardness | 55±5 Shore 00 | ASTM 2240 |
| Continuos Use Temp | -40 to 160℃ | ***** |
| Dielectric Constant | 4.7 MHz | ASTM D150 |
| Volume Resistivity | 7.3X1013Ohm-meter | ASTM D257 |
| Flame rating | 94 V0 | UL E331100 |
| Thermal conductivity | 4.0W/m-K | ASTM D5470 |
Standard Thicknesses
0.020-inch to 0.200-inch (0.5mm to 5.0mm)
Product Sizes:
8" x 16"(203mm x406mm)
Individual die cut shapesand and custom thickness can be supplied.
Please contact us for confirming
Packaging Details & Lead time
The packaging of thermal pad
1.with PET film or foam-for protection
2. use Paper Card To Separate Each Layer
3. export carton inside and outside
4. meet with customers' requirement-customized
Lead Time :Quantity(Pieces):5000
Est. Time(days): To be negotiated
Company Profile
With a wide range, good quality, reasonable prices and stylish designs, Ziitek thermal conductive interface materials are extensively used in Mainboards, VGA cards, Notebooks, DDR&DDR2 products, CD-ROM ,LCD TV, PDP products, Server Power products, Down lamps, Spotlights, Street lamps, Daylight lamps, LED Server Power products and others.
Certifications:
ISO9001:2015
ISO14001: 2004 IATF16949:2016
IECQ QC 080000:2017
UL
Independent R&D team
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TIF100N-40-10F Silicone Thermal Conductive Pad Cooling LED CPU GPU Heat Conductivity Interface Materials Images
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